Winbond W25X05CL
W25X05CL
| Density | 256 pages, 4KB sectors, 32/64KB blocks, Dual SPI, Fast Write | Status | |
|---|---|---|---|
| Vcc | 2.3V - 3.6V | Frequency | 80/104MHz(208MHz Dual-SPI) |
| Package | Temperature Range | -40℃~85℃ | |
| Feature List | Density 512kbit Voltage 2.3 - 3.6V Speed 104MHZ Package 150mil SOIC\VSOP Package 173mil TSSOP Package WSON 5x6mm Package USON 2x3mm 产品特点 N/A Package SOIC8 150mil,TSSOP8 173mil, USON 2x3mm, | ||
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